In response to the growing demand for digital infrastructure, Hyper Photonix will present three major technology themes at COMNEXT: 400G/800G/1.6T silicon photonics modules, low-power LPO silicon photonics modules, and MCF (multi-core fiber) optical modules. These innovations are designed to address key challenges in data centers — “cost-saving”“power-saving” and “space-saving” — and are expected to become critical enablers for future AI clusters and data center architectures.
Hyper Photonix announces its entrance into the US optical transceiver market with Hyper Silicon™ enabled 400G DR4 general availability and OFC 2023 participation as a first-time exhibitor.
