In response to the growing demand for digital infrastructure, Hyper Photonix will present three major technology themes at COMNEXT: 400G/800G/1.6T silicon photonics modules, low-power LPO silicon photonics modules, and MCF (multi-core fiber) optical modules. These innovations are designed to address key challenges in data centers — “cost-saving”“power-saving” and “space-saving” — and are expected to become critical enablers for future AI clusters and data center architectures.
Hyper Photonix—— New facility, currently in final stages of construction, is based in Anhui Province, China and will support the company’s aggressive manufacturing ramp to support Hyperscale Data Center worldwide demand for next generation optical transceivers.
