In response to the growing demand for digital infrastructure, Hyper Photonix will present three major technology themes at COMNEXT: 400G/800G/1.6T silicon photonics modules, low-power LPO silicon photonics modules, and MCF (multi-core fiber) optical modules. These innovations are designed to address key challenges in data centers — “cost-saving”“power-saving” and “space-saving” — and are expected to become critical enablers for future AI clusters and data center architectures.
In response to the growing demand for digital infrastructure, Hyper Photonix will present three major technology themes at COMNEXT: 400G/800G/1.6T silicon photonics modules, low-power LPO silicon photonics modules, and MCF (multi-core fiber) optical modules. These innovations are designed to address key challenges in data centers — “cost-saving”“power-saving” and “space-saving” — and are expected to become critical enablers for future AI clusters and data center architectures.
